Prototyping Shield for Raspberry Pi 2 /Model A /Model B

$ 1.79

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Now you can control the sound of the BOV from inside the cabin!

So how much more can you do with a blow-off valve? Well, the Deceptor Pro II takes the ‘Respons’ concept even further...

  • Adjust your BOV venting bias electronically on-the-fly
  • Revised porting to optimise flow and venting bias
  • Compact design fits in most factory valve locations
  • Direct bolt on for many vehicles
  • New bore finishing process ensures a lifetime of reliable operation

Deceptor Pro II features

Direct bolt-on for most vehicles available:

  • Remote proportional venting bias/volume control- from silent to loud or anywhere in between
  • Sleek, compact in-car BOV volume controller with backlit dial
  • End point adjustment to control maximum vent to atmosphere bias setting
  • Volume adjustment mechanism driven by a high-torque geared electric motor
  • Durable, low-friction ger train supported by precision sealed ball-bearing
  • Supplied with all parts and wiring required to have it up and running quickly and easily
This a Raspberry Pi Model B prototyping shield from Tinysine, You can stack it on your Raspberry Pi Model B easily. which can snap onto the Pi B main board assembly (and is removable later if you wish) and gives you all sorts of prototyping goodness to make building on top of the Pi B super easy. We added lots of basic but essential goodies. First up, there’s a big prototyping area, half of which is ‘breadboard’ style and half of which is ‘perfboard’ style so you can wire up DIP chips, sensors, and the like. Along the edges of the proto area, all the GPIO/I2C/SPI and power pins are broken out to 0.1″ stips so you can easily connect to them. On the edges of the prototyping area, all of the breakout pins are also connected to labeled 2.5mm screw-terminal blocks. This makes it easy to semi-permanently wire in sensors, LEDs, etc. There’s also a 4-block terminal block broken out to 0.1″ pads for general non-GPIO wiring. Finally, we had a little space remaining over the metal connectors so we put in an SOIC surface mount chip breakout area, for those chips that dont come in DIP format.

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